Bisphenol A bisallyl ether; bisphenol A diallyl ether
Molecular formula: C21H24O2
Molecular weight: 308.41
Diallyl bisphenol A is mainly used for the modification of bismaleimide resin, which can greatly reduce the application cost of BMI resin and improve the handleability and processability of BMI resin.
Bisphenol A diallyl ether is applied to the surface of semiconductor wafers, adhesives, photoresist materials, impact prepregs, fiber reinforced structural parts, high temperature and chemical resistant mixed materials, high temperature coating, waterproof, Anti-corrosion and other functions.