2,2'-diallyl bisphenol A; o-diallyl bisphenol A; 4,4'-(1-methylethylidene)bis[2-(2-propenyl)]phenol
Molecular formula: C21H24O2
Molecular weight: 308.41
Refractive index: 1.587
Flash point: >110 oC
The o-diallyl bisphenol A is mainly used for the modification of Bismaleimide (BMI), which can greatly reduce the application cost of BMI resin and improve the operability and processability of BMI resin. Improve the toughness, heat resistance and moldability of BMI resin. Can be used for electrical insulation materials, copper clad circuit boards, high temperature impregnating varnish, insulating varnish laminates, molded plastics, etc. Wear-resistant materials, diamond grinding wheels, heavy-duty grinding wheels, brake pads, high temperature bearing adhesives, etc. Aerospace structural materials. Functional material. Anti-aging agent for rubber, adding 1-3% BBA to rubber can greatly improve the aging resistance of rubber.