在南通酒店晚上怎么叫服务

在南通酒店晚上怎么叫服务

bhpf

The molecular formula of bisphenol fluorene: c25h18o2, molecular weight: 350.41cas: 3236-71-3, melting point: 224-226 The main purpose of the hydroxy C bisphenol fluorene is to be used as the monomer and modifier of functional polymer materials. The fluorene based epoxy resin synthesized from it has excellent hygrothermal resistance, dielectric properties, mechanical properties, chemical resistance and other comprehensive properties. It has become an important monomer and modifier for high performance matrix resin materials, electronic packaging materials, high temperature resistant adhesives, high temperature resistant coatings, etc It has a certain application prospect in ablation resistant resin, dental materials, engineering plastics and other fields.

bhpf

Molecular formula: c25h18o2

Molecular weight: 350.41

CAS:3236-71-3

Melting point: 224-226 ° C

Bisphenol fluorene is mainly used as monomer and modifier of functional polymer materials. The fluorene based epoxy resin synthesized from bisphenol fluorene has excellent hygrothermal resistance, dielectric properties, mechanical properties, chemical resistance and other comprehensive properties. It has become an important monomer and modifier for high performance matrix resin materials, electronic packaging materials, high temperature resistant adhesives, high temperature resistant coatings, etc It has a certain application prospect in ablation resistant resin, dental materials, engineering plastics and other fields.