在南通酒店晚上怎么叫服务

在南通酒店晚上怎么叫服务

sell 4,4'-Methylenebis(N,N-diglycidylaniline); AG80/MY-721; 4,4'-Methylenebis[N,N-bis(2,3-epoxypropyl)aniline]; 28768-32-3

4,4'-Methylenebis (N, N-diglycidylaniline) Low viscosity, good processing technology, long-term high temperature resistance, good mechanical strength durability, low curing shrinkage, good chemical resistance, good radiation resistance. It is a tetraglycidylamine-type special epoxy resin, and its actual functionality is about 3-3.5. Can be cured with aromatic amines, acid anhydrides, dicyandiamide and imidazole curing agents. With its excellent adhesion, heat resistance and high modulus, it can be made into high-performance carbon fiber composite materials. 4,4'-diaminodiphenylmethane epoxy resin / 4, 4'-diaminodiphenylsulfone / boron trifluoride ethylamine complex system has become a typical matrix system of 170-degree cured carbon fiber composite materials, has been Composite materials for aircraft substructures and aerospace structural composites. It can also be used as a conductive adhesive for heat-resistant adhesives. Red brown to amber viscous liquid. The epoxy resin is 111-118g / mol, and the epoxy value is 0.85-0.90mol / 100g. Tetraglycidylamine epoxy resin is characterized by multifunctionality, low viscosity, high activity, strong adhesion, high crosslink density of cured products, low shrinkage, excellent mechanical properties, heat resistance and corrosion resistance , But poor heat and humidity resistance. Its activity is 10 times that of bisphenol A epoxy resin. Tertiary amines can promote ring opening of epoxy groups. Diaminodiphenyl sulfone is used as a curing agent for curing. The tensile modulus is 3.7 Gpa, the thermal expansion coefficient is 5.7x10-5, and the heat resistance is about 246. Boron trifluoride-monoethylamine can accelerate the curing reaction. In the carbon fiber composite mandrel, the epoxy resins are high temperature tough resins AG80 / MY-721 and 648 epoxy resins. AG80 / MY-721 is used as carbon fiber composite material, glass fiber composite material, high temperature resistant adhesive, high temperature electrical casting, high temperature resistant electrical insulation material.

4,4'-Methylenebis(N,N-diglycidylaniline); AG80/MY-721;
Synonyms:4,4'-Methylenebis[N,N-bis(2,3-epoxypropyl)aniline]
Molecular Formula:C25H30N2O4
Molecular Weight:422.52
CAS:28768-32-3
EINECS:249-204-3
Density:1.15
Refractive index:1.601
Flash point:113 ºC

4,4'-Methylenebis (N, N-diglycidylaniline) Low viscosity, good processing technology, long-term high temperature resistance, good mechanical strength durability, low curing shrinkage, good chemical resistance, good radiation resistance. It is a tetraglycidylamine-type special epoxy resin, and its actual functionality is about 3-3.5. Can be cured with aromatic amines, acid anhydrides, dicyandiamide and imidazole curing agents. With its excellent adhesion, heat resistance and high modulus, it can be made into high-performance carbon fiber composite materials. 4,4'-diaminodiphenylmethane epoxy resin / 4, 4'-diaminodiphenylsulfone / boron trifluoride ethylamine complex system has become a typical matrix system of 170-degree cured carbon fiber composite materials, has been Composite materials for aircraft substructures and aerospace structural composites. It can also be used as a conductive adhesive for heat-resistant adhesives. Red brown to amber viscous liquid. The epoxy resin is 111-118g / mol, and the epoxy value is 0.85-0.90mol / 100g. Tetraglycidylamine epoxy resin is characterized by multifunctionality, low viscosity, high activity, strong adhesion, high crosslink density of cured products, low shrinkage, excellent mechanical properties, heat resistance and corrosion resistance , But poor heat and humidity resistance. Its activity is 10 times that of bisphenol A epoxy resin. Tertiary amines can promote ring opening of epoxy groups. Diaminodiphenyl sulfone is used as a curing agent for curing. The tensile modulus is 3.7 Gpa, the thermal expansion coefficient is 5.7x10-5, and the heat resistance is about 246. Boron trifluoride-monoethylamine can accelerate the curing reaction. In the carbon fiber composite mandrel, the epoxy resins are high temperature tough resins AG80 / MY-721 and 648 epoxy resins. AG80 / MY-721 is used as carbon fiber composite material, glass fiber composite material, high temperature resistant adhesive, high temperature electrical casting, high temperature resistant electrical insulation material.