在南通酒店晚上怎么叫服务

在南通酒店晚上怎么叫服务

sell bisphenol F diglycidyl ether; bisphenol F; bisphenol-F; bisphenol F epoxy resins; liquid bisphenol F epoxy resins; solid bisphenol F epoxy resin (Does not contain bisphenol A)

The bisphenol F epoxy resin not only reduces the viscosity of the bisphenol A epoxy resin itself but also has the same properties as the bisphenol A epoxy resin. Bisphenol F epoxy resin can be used in solvent-free solid coatings, casting and casting molding materials, laminates and other areas require low viscosity (such as glass fiber reinforced plastic and carbon fiber composite materials, etc.). As the bisphenol F epoxy resin or bisphenol F and bisphenol A blended epoxy resin has good heat resistance, water resistance and electrical properties, can also be used for transformers and other casting and potting materials, semiconductor Sealing materials, semiconductor conductive plastic and other fields.

bisphenol-F-epoxy

Description :

Bisphenol F diglycidyl ether; BFDGE; Bis(4-glycidyloxyphenyl)methane; Bis[4-[(oxiran-2-yl)methoxy]phenyl]methane; 2,2'-[methylenebis(p-phenyleneoxymethylene)]bisoxirane;2-((4-[4-(2-Oxiranylmethoxy)benzyl]phenoxy)methyl)oxirane;

CAS:2095-03-6

Molecular Formula:C19H20O4

Molecular Weight:312.36

EINECS:218-257-4

Short Description  : The bisphenol F epoxy resin not only reduces the viscosity of the bisphenol A epoxy resin itself but also has the same properties as the bisphenol A epoxy resin. Bisphenol F epoxy resin can be used in solvent-free solid coatings, casting and casting molding materials, laminates and other areas require low viscosity (such as glass fiber reinforced plastic and carbon fiber composite materials, etc.). As the bisphenol F epoxy resin or bisphenol F and bisphenol A blended epoxy resin has good heat resistance, water resistance and electrical properties, can also be used for transformers and other casting and potting materials, semiconductor Sealing materials, semiconductor conductive plastic and other fields.

Meta Keywords : bisphenol F epoxy resin; solvent-free solid coatings, casting and casting molding materials, laminates require low viscosity (such as glass fiber reinforced plastic and carbon fiber composite materials, etc.). good heat resistance, water resistance; electrical properties, transformers and other casting and potting materials, semiconductor Sealing materials, semiconductor conductive plastic.

Meta Description : Bisphenol F epoxy resin with heat resistance, water resistance and electrical properties, can be used for casting and potting materials, semiconductor sealants, semiconductor conductive adhesive, solvent-free solid paint.