在南通酒店晚上怎么叫服务

在南通酒店晚上怎么叫服务

sell Bis(2,3-epoxypropyl) cyclohex-4-ene-1,2-dicarboxylate

Bis(2,3-epoxypropyl) cyclohex-4-ene-1,2-dicarboxylate is used in coatings, composites, adhesives, electronics, and more. It has strong ultra-low temperature resistance, and the shear strength at -253-196 °C is higher than that of bisphenol A epoxy resin. It has good compatibility with other epoxy resins. It can reduce viscosity, improve performance and have high reactivity when mixed with common epoxy resin. When triethylenetetramine, diaminodiphenylmethane and hexahydrophthalic anhydride are used as curing agents, gel The time can be shortened by nearly half compared with the bisphenol A type epoxy resin; the transparency is good, and the light transmittance of the product cured with m-xylyleneamine at 50 ° C / 2 h can reach 81%. Used as a reactive diluent for epoxy resin adhesives to improve processability, low temperature resistance, bond strength, etc.

Bis(2,3-epoxypropyl) cyclohex-4-ene-1,2-dicarboxylate

Synonyms:4-Cyclohexene-1,2-dicarboxylic acid bis(oxiranylmethyl) ester

Molecular Formula:C14H18O6

Molecular Weight:282.29

CAS:21544-03-6

EINECS:244-435-6

Refractive index: 1.532

Flash point: 184.2 ° C

Density: 1.309g/cm3

Epoxy equivalent (Gm/Eq): 150.0-180.0

Bis(2,3-epoxypropyl) cyclohex-4-ene-1,2-dicarboxylate is used in coatings, composites, adhesives, electronics, and more. It has strong ultra-low temperature resistance, and the shear strength at -253-196 °C is higher than that of bisphenol A epoxy resin.

It has good compatibility with other epoxy resins. It can reduce viscosity, improve performance and have high reactivity when mixed with common epoxy resin. When triethylenetetramine, diaminodiphenylmethane and hexahydrophthalic anhydride are used as curing agents, gel The time can be shortened by nearly half compared with the bisphenol A type epoxy resin; the transparency is good, and the light transmittance of the product cured with m-xylyleneamine at 50 ° C / 2 h can reach 81%. Used as a reactive diluent for epoxy resin adhesives to improve processability, low temperature resistance, bond strength, etc.